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The FDG6332C device is designed to provide excellent power dissipation in an ultra-small footprint, making it ideal for applications where the larger and more expensive TSSOP-8 and SSOP-6 packages cannot be used.

N- and P-channel MOSFETs are produced using Fairchild’s advanced PowerTrench process, which is specially tailored to minimize on-state resistance while maintaining excellent switching performance.

FDG6332C device applications: DC/DC converters, load switches, LCD display inverters


Low gate charge

High-performance trench technology for extremely low RDS(ON)

SC70-6 package: small footprint (51% smaller than SSOT-6); low profile (1mm thick)

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